Modeling the ‘Language’ of the Brain with Soft 3D Devices

Research seminar with Hui Fang, associate professor of engineering, Dartmouth

5/1/2026
3:30 pm - 4:30 pm
Location
Spanos Auditorium, Cummings Hall
Sponsored by
Thayer School of Engineering
Audience
Public
More information
Amos Johnson

ZOOM LINK
Meeting ID: 935 8655 7757
Passcode: 008066

Enabled by foundational advances such as the patch-clamp technique and microelectrodes, the quest to understand the brain has made tremendous progress over the past five decades and is transforming the treatment of difficult neurological and sensory conditions.  

In this talk, I will present recent advances in neuroelectronics from my group, driven by innovations in materials and device engineering at the micro- and nanoscale. In particular, I will highlight neural interface technologies built on polymeric substrates, integrating research in materials science, electrical engineering, and neural engineering. These systems, aimed at significantly improving the ability to listen to and real-time translate the electrical and chemical ‘language’ of the brain, offer new opportunities for biocompatibility, scalability, and multimodal functionality. Looking forward, we envision that continued advances in materials-enabled neurotechnology will not only expand the frontiers of neuroscience research but also enable clinically translatable devices that redefine what is possible in diagnosis, monitoring, and treatment.

Location
Spanos Auditorium, Cummings Hall
Sponsored by
Thayer School of Engineering
Audience
Public
More information
Amos Johnson